The LED backlight source and the CCFL backlight source are basically identical in structure. The main difference is that the LED is a point light source, and the CCFL is a line light source. From the long-term trend, the existence of LED backlight technology as a replacement technology product will surely gradually spread.
Here's a preliminary understanding of the LED backlight production process:
A. Cleaning: Ultrasonic cleaning PCB or LED lead frame, and drying.
B. Arrangement: After the silver electrode is prepared on the bottom electrode of the LED chip (large wafer), the expanded chip (large wafer) is placed on the acupuncture table and the dies are one by one under the microscope. Mounted on the corresponding pads of the PCB or LED support and then sintered to cure the silver paste.
C. Pressure welding: The electrode is connected to the LED die with an aluminum wire or a gold wire bonder for current injection. The LED is directly mounted on the PCB, generally using an aluminum wire bonder. (The production of white light TOP-LED requires a gold wire welder)
D. Package: Protect the LED die and wire with epoxy by dispensing. Dispensing on the PCB board has strict requirements on the shape of the colloid after curing, which is directly related to the brightness of the finished product of the backlight source. This process will also take on the task of spotting fluorescent powder (white LED).
E. Welding: If the backlight source is an SMD-LED or other packaged LED, the LED needs to be soldered to the PCB before the assembly process.
F. Cut film: Various diffusion films, reflective films, etc. required for die-cutting a backlight with a punch.
G. Assembly: According to the requirements of the drawings, the various materials of the backlight are manually installed in the correct position.
H. Test: Check whether the backlight photoelectric parameters and light uniformity are good.
I. Packaging: Pack the finished products as required and store them in the warehouse.
Here's a preliminary understanding of the LED backlight production process:
A. Cleaning: Ultrasonic cleaning PCB or LED lead frame, and drying.
B. Arrangement: After the silver electrode is prepared on the bottom electrode of the LED chip (large wafer), the expanded chip (large wafer) is placed on the acupuncture table and the dies are one by one under the microscope. Mounted on the corresponding pads of the PCB or LED support and then sintered to cure the silver paste.
C. Pressure welding: The electrode is connected to the LED die with an aluminum wire or a gold wire bonder for current injection. The LED is directly mounted on the PCB, generally using an aluminum wire bonder. (The production of white light TOP-LED requires a gold wire welder)
D. Package: Protect the LED die and wire with epoxy by dispensing. Dispensing on the PCB board has strict requirements on the shape of the colloid after curing, which is directly related to the brightness of the finished product of the backlight source. This process will also take on the task of spotting fluorescent powder (white LED).
E. Welding: If the backlight source is an SMD-LED or other packaged LED, the LED needs to be soldered to the PCB before the assembly process.
F. Cut film: Various diffusion films, reflective films, etc. required for die-cutting a backlight with a punch.
G. Assembly: According to the requirements of the drawings, the various materials of the backlight are manually installed in the correct position.
H. Test: Check whether the backlight photoelectric parameters and light uniformity are good.
I. Packaging: Pack the finished products as required and store them in the warehouse.
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