TSMC is the lifeblood of many non-factory semiconductor companies. However, in the past two years, the world's first-generation foundry has repeatedly been disappointing. Nowadays, 40nm shines, and the next generation of 28nm has a tendency to repeat the same mistakes. TSMC CEO and chairman of the board of directors Zhang Zhongmou recently said: "We have completed the use of 28nm process of 89 different product flowsheets, each of which is implemented on schedule. Each time the first silicon wafers have full functionality, the yield rate is also Satisfaction... However, due to the softening of the economic situation and market demand in 2011, the 28-nm production will take longer than expected.
Terry Ho, CFO and senior vice president of TSMC, said similarly: “The delay of 28nm is not due to quality issues. The tapeout is good. The delay is mainly due to the softening of our customers' economy and not planned. The 28nm process in the fourth quarter of this year The contribution to total wafer revenue is about 1%."
TSMC has developed a total of four different uses of 28nm process, including CLN28HP HKMG for high-performance products, CLN28HPM HKMG for mobile computing products, CLN28HPL HKMG for low leakage rate low-power products, CLN28LP SION for low-cost products.
The slow progress of TSMC will force AMD and NVIDIA to adopt different 28nm processes. Among them, AMD's next generation Radeon HD 7000 series in the South Islands will first adopt CLN28HPL HKMG, and it is expected to begin mass production in the fourth quarter of this year; NVIDIA Kepler will need to wait for CLN28HP. HKMG, mass production at least in the first quarter of next year.
In the second quarter of this year, the proportion of 40nm contribution to TSMC’s total revenue increased by 4 percentage points to 26%, 65/55nm fell again to 29%, and the old 150+nm remained firmly controlled by 28%. The share of the remaining 130/110nm, 90/80nm less than 10%.
Due to the situation, TSMC has also adjusted its wafer production plan for 2011. The annual production capacity of 200mm wafers is estimated to be 13.248 million units, an increase of 17% year-on-year, which is a decrease of 22.8 million units compared to the previous plan. Another 300 Millimeter wafer production capacity will increase by 30% this year.
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