A few days ago, it was reported that LG's flagship mobile phone G6 is likely to use heat pipe cooling. Maybe the news partner may ask, is the heat pipe cooling a heat pipe in the phone? Lenovo's previous domestic OPPO announced The ice nest cooling technology, the heat dissipation technology of the mobile phone industry can be described as "a hundred flowers in the air", in fact, the development of heat dissipation technology to the present, come and go is nothing more than that, today take everyone to understand the trick behind these cooling technology.
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graphite
When it comes to heat-dissipating materials, it is impossible to mention graphite. As a kind of metal material with more thermal conductivity than steel, iron, lead, etc., graphite is used in mobile phones and flats of major brands, saying that it is the basic heat-dissipating material. Not too much. As early as the Xiaomi 1 generation mobile phone, the heat dissipation method adopted is graphite heat dissipation.
Graphite itself has good properties such as high temperature resistance, electrical and thermal conductivity, chemical stability, plasticity and thermal shock resistance. The graphite heat sink used in mobile phone heat dissipation is a good heat conduction and heat dissipation material with unique crystal. The grain orientation, uniform heat dissipation, and the sheet structure can be applied to any surface well.
The principle of heat dissipation of graphite actually utilizes the unique grain orientation of graphite, which conducts heat uniformly in two directions and can be attached to the circuit board inside the mobile phone, which can block the contact between components and also play a certain role. The anti-seismic effect. Due to its high thermal conductivity, it can quickly transfer heat from the processor to various locations of the large-area graphite film for heat dissipation, which indirectly acts as a heat sink.
Metal backplane
In the early stage of the development of smart phones, due to the limitations of PCB and chip technology, the gap between the various components inside the mobile phone is still relatively large. The use of graphite as the heat dissipation configuration can basically meet the heat dissipation requirements of the chip. However, as the mobile phone is moving toward thinner and lighter, the original spacious interior space becomes more and more “crowdedâ€, and the space for air circulation in the mobile phone is getting smaller and smaller. At this time, only graphite is used to dissipate heat. Not enough.
Apple uses a metal backplane heat sink technology in the iPhone with a metal case. Based on the graphite heat sink film, a metal heat conductive plate is also designed inside the metal case, which can be used to export graphite. The heat is directly transmitted to all corners of the metal body through the metal heat conduction plate, so that the heat in the sealed space can quickly spread and disappear, and the person does not feel too much heat when holding.
Silicone grease
Silicone grease, which is commonly known as thermal grease, is a paste made of a special silicone oil as a base oil, a new metal oxide as a filler, and a variety of functional additives. Good thermal conductivity, temperature resistance and insulation properties make it an ideal transmission medium for heat sinks.
A friend familiar with PC DIY may know that before installing the CPU, it is necessary to apply a layer of grease to the CPU cover so that the CPU and the heat sink can quickly transfer the heat of the CPU to the heat sink. Similarly, the manufacturer also extended the cooling idea on the PC to the mobile phone processor. The previous glory 6 used a silicone-based thermal gel heat sink on the processor. The conduction effect of this medium is better than that of graphite. better.
Ice Nest Heat Dissipation - Evolution of Silicone Grease Materials
The concept of ice nest heat dissipation was first widely used by OPPO R5. In fact, it has no advanced point in terms of heat dissipation. Its heat dissipation principle is similar to that of silicone grease, which is achieved by filling the gap between the heat sink and the CPU. The role of heat transfer. However, unlike silicone grease, the heat sink used in the heat dissipation of the ice nest is not a silicone grease, but a phase change material like a liquid metal.
The phase change material of liquid metal used by OPPO will gradually change from solid to liquid when the temperature rises, while absorbing a large amount of heat. So in addition to transferring heat, it also absorbs a portion of the heat. This phase change material has a higher efficiency in heat dissipation than a solid silicone grease.
Although this material has natural advantages, its own endothermic and thermal properties are much higher than air, but the cost of this method of heat dissipation is relatively high, and it is not suitable for popularization. More importantly, this phase change material The combination with the metal shield cover also has certain challenges, and if it is slightly careless, it is easy to cause material leakage.
Heat pipe cooling
As the name implies, the so-called heat pipe technology is to cover the apex of a liquid-filled heat-conducting copper tube on the mobile phone processor. When the processor calculates heat, the liquid in the heat pipe absorbs heat and vaporizes. These gases pass through the heat pipe to reach the top of the mobile phone. After the cooling area is cooled and condensed, it returns to the processor part again, and it is repeated to effectively dissipate heat.
The heat pipe heat dissipation applied on the mobile phone is also extended from the PC field, and similar heat dissipation technology is already standard on the notebook. The earliest mobile phone using heat pipe cooling was released by Japanese smartphone manufacturer NEC in 2013. The NEC N-06E is internally packaged with a heat pipe filled with pure water. The heat pipe is fully integrated with the graphite heat sink in parallel with the main board, and will be processed quickly. The heat generated by the device is conducted to the polycarbonate casing. Then the technology like Sony Z2, Microsoft's Lumia 950/950XL, and domestic 360 phones have been used.
Where is the direction of future heat dissipation?
No matter what kind of heat-dissipating material and heat-dissipation method, the purpose is not to dissipate heat for heat dissipation. It is more like a product of compromise under current process limitations. If you want to solve the problem of heat generation fundamentally, you still have to process from the processor and The architecture and the overall design of the mobile phone are considered, but the performance and heat generation of the processor seem to be an irreconcilable contradiction. From this point of view, the idea of ​​pure ultra-low power consumption and super performance is also Unrealistic.
In most cases, we don't need that much performance, and the processor doesn't have to be fully loaded at all times. Therefore, in the fact that the multi-core processor already exists, the chip side proposes to open and close the high-frequency core according to the performance required by the program. This idea of ​​actively controlling power consumption and heat generation by the processor is more worthy of promotion from the implementation. .
Of course, the topic of heat dissipation is also very wide. In the future, if the heat problem is improved, both hardware and software need to be improved to produce synergy. The first is the processor design and process improvement, and the software optimization for the hardware, as well as the design of the mobile phone body material and structure, only comprehensive consideration, we can say that mobile phone cooling can have a better solution.
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