In order to compete with Chinese manufacturers, Seoul Semiconductor and LG Innotek actively develop "gallium nitride" (GaN) substrates, and the packaging and testing plant also intentionally replaces epoxy resin (Epoxy) with silicon. Product performance and longevity.
Korean media reported on the 17th that LED lighting is currently dominated by sapphire substrates and silicon carbide (SiC) substrates. Hanfang researched "GaN-on-GaN" substrates (GaN-on-GaN). Solve the problem of dislocation. Seoul Semiconductor invested more than 10 years ago in research and development, obtained relevant patents, and previously launched "nPola" products, which are 5-10 times brighter than current LED lighting. The company claims to announce more advanced products than nPola soon.
LG Innotek also joined the development of this technology, but GaN is expensive, the company is still adjusting the product launch time.
In the packaging and testing plant, Han Factory began to use silicon as a packaging material to replace epoxy resin. When the epoxy resin is used for 3,000 to 6,000 hours, color shift phenomenon occurs, and the silicon usage time is 10 times longer, and 30,000 to 50,000 hours can be used. In addition, manufacturers are also developing materials that are cheaper than silicon.
According to industry insiders, the performance of GaN and silicon is better than current materials. The disadvantage is that it is expensive. To increase market competitiveness, it is necessary to lower prices and improve performance.
Japanese media reported on July 11 that Toshiba plans to officially mass-produce white LED products within this year (in 2014), with the goal of significantly expanding its monthly production capacity to 150 times.
Toshiba's white LEDs use the company's "GaN-on-Si" LED components developed by the US white LED manufacturer Bridgelux; TSMC (2330) to invest in the company, and the current LED components using sapphire wafers. More competitive than price. Toshiba acquired the white LED chip related assets such as GaN-on-Silicon technology owned by Preh in April 2013.
Korean media reported on the 17th that LED lighting is currently dominated by sapphire substrates and silicon carbide (SiC) substrates. Hanfang researched "GaN-on-GaN" substrates (GaN-on-GaN). Solve the problem of dislocation. Seoul Semiconductor invested more than 10 years ago in research and development, obtained relevant patents, and previously launched "nPola" products, which are 5-10 times brighter than current LED lighting. The company claims to announce more advanced products than nPola soon.
LG Innotek also joined the development of this technology, but GaN is expensive, the company is still adjusting the product launch time.
In the packaging and testing plant, Han Factory began to use silicon as a packaging material to replace epoxy resin. When the epoxy resin is used for 3,000 to 6,000 hours, color shift phenomenon occurs, and the silicon usage time is 10 times longer, and 30,000 to 50,000 hours can be used. In addition, manufacturers are also developing materials that are cheaper than silicon.
According to industry insiders, the performance of GaN and silicon is better than current materials. The disadvantage is that it is expensive. To increase market competitiveness, it is necessary to lower prices and improve performance.
Japanese media reported on July 11 that Toshiba plans to officially mass-produce white LED products within this year (in 2014), with the goal of significantly expanding its monthly production capacity to 150 times.
Toshiba's white LEDs use the company's "GaN-on-Si" LED components developed by the US white LED manufacturer Bridgelux; TSMC (2330) to invest in the company, and the current LED components using sapphire wafers. More competitive than price. Toshiba acquired the white LED chip related assets such as GaN-on-Silicon technology owned by Preh in April 2013.
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