Although the global economic situation is still difficult to determine, it has recently been reported that China plans to invest $50 billion in semiconductor-related projects between now and 2020. This news has increased DEK's confidence in the Asian electronics market.
Despite the long-term boom in the electronics industry, short-term demand requires packaging companies to carefully examine equipment utilization, cost of ownership, and supply chain efficiency. Combine these with a single system that solves multiple applications while collaborating with knowledgeable vendors that can make a positive return on process improvement, and selecting fewer but more capable vendors in the supply chain. Helps package companies reduce costs and maintain their competitiveness.
In terms of packaging technology, significant progress has been made in processing and processing more meager, thinner and more complex chip devices in a more cost effective manner. The development of DEK wafer coating technology enables packaging companies to print chip adhesives to the back side of wafers using proven material coating techniques, making the cost of high volume manufacturing lower than ever.
In addition, the same high-precision high-volume imaging equipment can be applied to other packaging processes such as solder ball placement, thermally conductive material coating, and wafer bumping. As a technology-driven company, DEK will continue to meet the technical needs of our customers now and in the future, and to make customer needs and their profits at the heart of our technology development.
Despite the long-term boom in the electronics industry, short-term demand requires packaging companies to carefully examine equipment utilization, cost of ownership, and supply chain efficiency. Combine these with a single system that solves multiple applications while collaborating with knowledgeable vendors that can make a positive return on process improvement, and selecting fewer but more capable vendors in the supply chain. Helps package companies reduce costs and maintain their competitiveness.
In terms of packaging technology, significant progress has been made in processing and processing more meager, thinner and more complex chip devices in a more cost effective manner. The development of DEK wafer coating technology enables packaging companies to print chip adhesives to the back side of wafers using proven material coating techniques, making the cost of high volume manufacturing lower than ever.
In addition, the same high-precision high-volume imaging equipment can be applied to other packaging processes such as solder ball placement, thermally conductive material coating, and wafer bumping. As a technology-driven company, DEK will continue to meet the technical needs of our customers now and in the future, and to make customer needs and their profits at the heart of our technology development.
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