The AREA scientific research organization of Universal Instruments Advanced Technology Lab has recently won the participation of German Henkel Electronic Materials and Keysight Technology as a member, making AREA scientific research organization even more powerful, enhancing the development strength of cutting-edge technology and leading the development of electronic assembly industry.
The AREA research organization led by Universal Instruments held the 79th conference on the campus of Binghamton University near the headquarters of Universal Instruments in New York. At the meeting, we welcome Henkel Electronic Materials and Keysight Technology (the electronic measurement company that was spun off from Agilent Technologies) to join the membership, bringing more different perspectives to AREA's research work and bringing the research capabilities to the next level. floor.
“The members of the AREA Research Organization are all global leaders from the electronics industry. Each member brings unique insights and challenging thinking to our research work,†said Dr. Jim Wilcox, AREA Research Organization Manager. “Because we have different professional scopes from the electronics industry, we can provide more comprehensive and extensive in-depth research on emerging technologies in the electronics industry.â€
AREA research organization has been established for nearly 20 years, and about 50 companies attended this two-day conference, including: Alcatel-Lucent, Sweden Autoliv, BTU International, CelesTIca, ASM AS (formerly DEK), Dell, Ericsson, Harris, Henkel, IBM, Indium Corporation, Korea Gao Yong, Lockheed Martin, Nihon Superior, Northrop Grumman, OK International, Rockwell Automation and USA Zebra Technologies. In addition, Fule and Boeing were also invited to attend the meeting as guests.
In this session, participants discussed a range of hot topics for board-level interconnect research, including reliability studies using alternative lead-free alloy solders, a wide variety of underfill materials, and conformal coatings. In addition, the conference also discussed the challenges faced by the current packaging industry, namely the characteristics and consequences of temperature-induced package and board warpage. Representatives of CelesTIca and IBM also released support data for two important research projects of AREA.
Wilcox praised members for their support of AREA's work. "From the technical report published at the meeting, we can find that AREA's research project requires the cooperation of industry and academia to achieve the purpose of AREA, and continue to conduct industry-related research every year."
One of the key research topics of AREA Research Group in 2015 is the evaluation report of fine-pitch copper pillars, including the research on interconnect reliability of 2.5D and 3D semiconductor packages, which is also the first AREA package for rapid development. Research on chemical technology. Corning will provide glass inserts to support this 2.5D package project, and its company representatives also attended the conference and introduced the background of this technology.
Universal Instruments' advanced laboratories also demonstrated their ever-increasing projects in reliability testing, including the upcoming vibration test and power cycle test.
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