[High-tech LED reporter Liu Pingping reports from Guangzhou] On November 25th, the 2013 High-tech LED Conference-CTO held in conjunction with the 2013 Gaogong LED Lighting Exhibition opened at the D meeting room of Hall 5, Guangzhou Poly World Trade Center. Dr. Xiao Guowei, Director and General Manager of Ke Electronics, presided over the meeting.
According to the upper, middle and lower reaches of the LED industry chain, the conference is divided into four special sessions, of which there are two special sessions in the middle. The meeting invited CTOs and executives from well-known enterprises in the LED industry chain to share the latest cutting-edge technologies in the industry and discuss the technological development trends of the upper, middle and lower reaches.
On the afternoon of November 25th, the first Tiantong Hi-tech Group titled the CTO Conference focused on “chip and equipment materialsâ€. Shen Tonghuan, director of Tiantong High-tech Products, first gave a speech on the theme of “Sapphire material is promisingâ€. He believes that large-size substrates will be the trend of the times.
Tiantong High-tech Products Director Shen Yihuan
Shen Yuhuan pointed out that large-size substrates can make more chips in each MOCVD, so the use of large-size sapphire substrates is one of the main means to reduce the cost of LED chips. Since the LED chip has an edge ineffective area, the larger the diameter, the more obvious the advantage of the number-to-diameter ratio of the chip. "In the case of a 6-inch substrate, the surface area is 9 times that of a 2-inch substrate, and the number of chips is 10.9 times that of a 2-inch substrate."
Wu Donghai, technical director of Tongfang Optoelectronics and Lighting Industry, analyzed the "how many different chips are in the future."
Wu Donghai, Technical Director, Tongfang Opto Semiconductors and Lighting Industry
Wu Donghai believes that for the chip, the manufacturing cost should not be further reduced, but also on this basis, the luminous efficiency of the chip should be continuously improved. "The injection of high current has become an inevitable trend, and the chip area has to be gradually reduced." Wu Donghai said that the new demand has also put forward new requirements for the chip. The injection of large current requires the chip to have low Vf and excellent IV performance. Also have a low Droop effect and good heat dissipation. With the development of the new Flip-Chip technology, the advantages of the Flip-Chip chip become more and more obvious. "The new Flip-Chip chip technology has good heat dissipation and is more suitable for high current injection. In high-power products. Has a clear advantage."
After Shen Yuhuan and Wu Donghai analyzed the market and technology trends of sapphire substrates and chips, Ye Guoguang, the marketing director of Guangdong Deli Optoelectronics Co., Ltd., a wholly-owned subsidiary of Guangdong Ganhua (000576), focused on the market. How the demand drives the advancement of technology."
Ye Guoguang, Director of Marketing Center, Guangdong Deli Photoelectric Co., Ltd.
Ye Guoguang pointed out that the market role determines the technical requirements. At present, the technical improvement is mainly focused on how to improve the light efficiency of the chip area per unit area. The core of the upstream chip and the extension technology is still to “enhance brightness and reduce voltageâ€.
"Improve the efficiency of light extraction, reduce power consumption, and at the same time further control the cost, will play a greater competitive edge." Ye Guoguang believes that there will be no disruptive epitaxial chip technology in the future, after 2015, Technology will no longer be the dominant force in the market, and brands and special specifications are the main players in the market.
Ji Yong, chairman of Guizhou Haotian Optoelectronics, explained a new technology to the preparation of sapphire by PVE (physical vapor epitaxy). According to Ji Yong, PVE includes kinetic energy conversion process, momentum conversion process, physical vapor deposition, surface migration and other processes.
Guizhou Yongtian Photoelectric Chairman Ji Yongyong
Ji Yong said that in the future, sapphire crystals will develop toward low defects, no bubbles, large size, and regular shape.
At the end of the meeting, Dr. Zhang Wei, Chief Technology Officer and Vice President of Zhonghao Optoelectronics, discussed the “Road of MOCVD Equipment Localizationâ€. 
Zhang Wei, Chief Technology Officer and Vice President of Zhonghao Optoelectronics
Dr. Zhang Wei said that the premise of localization of MOCVD equipment is that the performance of domestic MOCVD should be excellent and meet the development needs of the industry. At the same time, MOCVD localization also needs the support of epitaxial chip companies and the policy support of the country.
"In the journey to achieve the strategic goal of localization of MOCVD equipment, we will also face various challenges. While continuously improving performance to meet production needs, domestic equipment needs to be tested and approved by the market." Dr. Zhang Wei said The stage domestic MOCVD equipment can not only be imitated, it must have independent innovation ability, and the future domestic manufacturers can only rely on their internal strength.
Dr. Zhang Wei believes that with the support of national policies and the improvement of domestic technology, under the premise that China has become a major LED manufacturing country, the market opportunities for domestic MOCVD equipment will continue to emerge in the future.
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