On January 31, at the appraisal meeting of the Chinese Academy of Sciences "Low-cost high-efficiency improved MCOB packaging materials and technology integration for LED indoor lighting" held in Putian, Fujian, the expert committee of the appraisal committee agreed that the technology has complete independent intellectual property rights. And has achieved large-scale industrialization, the technical indicators of products have reached the international advanced level.
The expert group agreed that after long-term basic research and engineering application research, the results formed the innovation of multi-functional, multi-cup, multi-chip (MCOB) packaging based on new materials through the design and development of packaging key materials. The integrated technology has significantly improved the light efficiency, effectively reduced the cost, achieved major breakthroughs in key materials and key technologies, has independent intellectual property rights, and has achieved scale industrialization.
Since 2009, the Institute of Material Structure of the Chinese Academy of Sciences and Fujian Wanbang Optoelectronics Technology Co., Ltd. have jointly developed the industrialization manufacturing technology of MCOB packaging materials and structures. Today, the light effects of the lamps and lanterns developed by them have reached international advanced level. Level, and the price is only 30% of the market's similar products. In 2012, the technology has achieved an annual output of 1.5 million LED bulbs and 1 million LED fluorescent strips.
The expert group believes that this result forms a complete independent intellectual property right from package materials to package structures, including four major innovations:
First, the design and development of a multi-functional high reflectivity optical ceramic film aluminum substrate, as a MCOB packaging substrate material, solves the problem of the usual silver film yellowing, breaks through the insulating thermal barrier, and improves the substrate reflectivity and light source efficacy. The package structure is simplified and the total cost of the luminaire is reduced by more than a quarter. The MCOB packaging technology of the substrate is used to realize the LED lighting effect of 153.37Lm/W, the color rendering index is 82.8, the LED lighting function is 154.72Lm/W, and the color rendering index is 70.2.
Secondly, the first use of the cast composite lamination process to develop an alumina composite ceramic substrate, achieving a combination of high diffuse reflection and high thermal conductivity, high electrical breakdown resistance, high reliability and other advantages, effectively improving the light source efficacy The light quality solves the problem of low reflection and low thermal conductivity of common alumina ceramic substrates. The composite ceramic substrate MCOB packaging technology is used to realize the LED light bulb 149.97Lm/W, the color rendering index is 82.5, the LED fluorescent light strip has a full light effect of 141.2Lm/W, and the color rendering index is 69.8.
Third, through the innovative process and crystal field modulation technology, a new generation of fluorescent materials with adjustable wavelength of luminescence, no surface defects, high quantum efficiency, low light decay, and transmittance close to the theoretical value - transparent ceramics with garnet structure The phosphor, using the novel transparent ceramic phosphor for MCOB packaging, significantly improves the reliability and light efficiency of the light source, simplifies the package structure, reduces the cost, and solves the color drift and light decay caused by the aging of the phosphor and the encapsulant. problem. At the same time, the double-sided light-emitting package structure was proposed and used for the first time, and the light source effect of the multi-chip package structure was 261Lm/W under low current driving.
Fourth, the use of improved MCOB technology integration (including the above three substrate packaging technology and chip post-processing technology, power technology, ceramic heat sink fin technology, high thermal conductivity primer technology, etc.) to form a low-cost, high-efficiency LED light source package and lighting technology The cost of LED products has dropped by more than a quarter, the efficiency has increased by 50%, and the performance indicators are leading internationally.
The expert group suggested that it is necessary to further accelerate the application of technology, especially the industrial application of transparent fluorescent ceramic technology, and expand the scale of the industry to enhance the core competitiveness of China's LED lighting industry.
The expert group agreed that after long-term basic research and engineering application research, the results formed the innovation of multi-functional, multi-cup, multi-chip (MCOB) packaging based on new materials through the design and development of packaging key materials. The integrated technology has significantly improved the light efficiency, effectively reduced the cost, achieved major breakthroughs in key materials and key technologies, has independent intellectual property rights, and has achieved scale industrialization.
Since 2009, the Institute of Material Structure of the Chinese Academy of Sciences and Fujian Wanbang Optoelectronics Technology Co., Ltd. have jointly developed the industrialization manufacturing technology of MCOB packaging materials and structures. Today, the light effects of the lamps and lanterns developed by them have reached international advanced level. Level, and the price is only 30% of the market's similar products. In 2012, the technology has achieved an annual output of 1.5 million LED bulbs and 1 million LED fluorescent strips.
The expert group believes that this result forms a complete independent intellectual property right from package materials to package structures, including four major innovations:
First, the design and development of a multi-functional high reflectivity optical ceramic film aluminum substrate, as a MCOB packaging substrate material, solves the problem of the usual silver film yellowing, breaks through the insulating thermal barrier, and improves the substrate reflectivity and light source efficacy. The package structure is simplified and the total cost of the luminaire is reduced by more than a quarter. The MCOB packaging technology of the substrate is used to realize the LED lighting effect of 153.37Lm/W, the color rendering index is 82.8, the LED lighting function is 154.72Lm/W, and the color rendering index is 70.2.
Secondly, the first use of the cast composite lamination process to develop an alumina composite ceramic substrate, achieving a combination of high diffuse reflection and high thermal conductivity, high electrical breakdown resistance, high reliability and other advantages, effectively improving the light source efficacy The light quality solves the problem of low reflection and low thermal conductivity of common alumina ceramic substrates. The composite ceramic substrate MCOB packaging technology is used to realize the LED light bulb 149.97Lm/W, the color rendering index is 82.5, the LED fluorescent light strip has a full light effect of 141.2Lm/W, and the color rendering index is 69.8.
Third, through the innovative process and crystal field modulation technology, a new generation of fluorescent materials with adjustable wavelength of luminescence, no surface defects, high quantum efficiency, low light decay, and transmittance close to the theoretical value - transparent ceramics with garnet structure The phosphor, using the novel transparent ceramic phosphor for MCOB packaging, significantly improves the reliability and light efficiency of the light source, simplifies the package structure, reduces the cost, and solves the color drift and light decay caused by the aging of the phosphor and the encapsulant. problem. At the same time, the double-sided light-emitting package structure was proposed and used for the first time, and the light source effect of the multi-chip package structure was 261Lm/W under low current driving.
Fourth, the use of improved MCOB technology integration (including the above three substrate packaging technology and chip post-processing technology, power technology, ceramic heat sink fin technology, high thermal conductivity primer technology, etc.) to form a low-cost, high-efficiency LED light source package and lighting technology The cost of LED products has dropped by more than a quarter, the efficiency has increased by 50%, and the performance indicators are leading internationally.
The expert group suggested that it is necessary to further accelerate the application of technology, especially the industrial application of transparent fluorescent ceramic technology, and expand the scale of the industry to enhance the core competitiveness of China's LED lighting industry.
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