German automotive industry focuses on the development of component systems for high-power electric drives

Munich, Germany, July 2, 2015 – The “HV-ModAL” research project aims to further increase the power of electric vehicle powertrains. HV-ModAL hopes to build a modular system kit for electric powertrains for all types of electric vehicles produced by different manufacturers in the next three years. Ten partners from all sectors of the automotive industry chain, including Infineon, and the scientific community participated in the research project to further consolidate the German automotive industry in electric vehicles – including pure electric vehicles and externally-charged hybrid vehicles. Small transport vehicles - the global market position of the field. Today's electric vehicles typically have a power of 125 kilowatts (kW) and a cruising range of 150 kilometers. The electric vehicle studied in this research project has a power range of 50 kW to 250 kW and a longer cruising range. HV-ModAL is the German acronym for "Modular Powertrain Topology for High Power Electric Vehicles".

Component research and system design

In the first phase of the project, HV-ModAL research partners are committed to reaching a consensus on the common electric drive platform for the entire automotive industry chain. They will then conduct extensive and in-depth conceptual and component studies to determine the components that are perfectly coordinated with each other for this electric drive platform.

The research involved a wide range of components, including high power transmissions up to 250 kW and high voltage IGBT power modules up to 900 V, modular multi-level DC/DC converters, batteries with integrated DC/DC converters, and System components for batteries above 600 V. To describe and define these components and then optimize them to coordinate with each other, project partners are building a common flexible system simulation model for different electric vehicle platforms. To validate the theoretical results, the project team will use the optimized components and architecture to create a demonstration model and experiment. Based on the results obtained, the HV-ModAL system design will be completed and eventually a modular system toolbox for the widest possible range of electric drive types will be created.

The project has a budget of around 7.5 million euros. About 50% of this will be funded by the German Federal Ministry of Education and Research (BMBF). This project will end on December 31, 2017. Infineon Technologies is the project responsible agency.

Partner of the HV-ModAL project

The project has a total of 10 partners from the automotive industry and research institutions, including automobile manufacturers BMW AG and Daimler AG, automotive system supplier Robert Bosch GmbH, drive system developer AVL and its A subsidiary of Stuttgart and Regensburg, the Fraunhofer Institute for Integrated Systems and Components Technology (IISB) in Erlangen, the University of Leibniz, Hannover, the Federal Defense Forces University of Munich and the Aachen University of Technology And semiconductor manufacturer Infineon Technologies AG.

About Infineon

Infineon Technologies AG is the world's leading semiconductor technology company, addressing three key challenges for modern society through product and system solutions: energy efficiency, mobility and security. In fiscal year 2014 (ending September 30), the company's sales amounted to 4.3 billion euros and it has approximately 29,800 employees worldwide. In January 2015, Infineon acquired US International Rectifier, a leading supplier of power management technology with annual revenues of US$1.1 billion (FY2014, which ends on June 29), approximately 4 , 200 employees. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and the US over-the-counter market OTCQX InternaTIonal Premier (ticker symbol: IFNNY).

Infineon in China

Infineon Technologies AG officially entered the Chinese market in 1995. Since the establishment of the first company in Wuxi in 1996, Infineon's business has grown very rapidly. With more than 1,800 employees in China, it has become an important driving force for Infineon's Asia Pacific and global business development. Infineon has established a complete industrial chain covering R&D, production, sales, marketing and technical support in China, and has carried out in-depth research with leading domestic enterprises and universities in sales, technology research and development, and personnel training. Cooperation.

Coaxial Power D-Sub Solder Cup

Coaxial Power D-Sub Solder Cup Contacts with Mixed or Full Layout
Transmit Radio Frequency Signals

The Coaxial D-Sub have like the Power D-Subr replaced the two rows in a Standard Density connector with a coaxial contact that take up about the same size as the two rows of signal contacts. The Coaxial D-Sub is exactly the same size as the Standard Density connector but instead of example 9 positions of signal pins it has 2 power contacts , or instead of 37 positions of signals it has 8 coaxial contacts.

The Impedance for the coaxial contacts are 50Ω or 75Ω


All Signals, but different Signals
The Coaxial D-Sub with Mixed Layout mixes both coaxial contacts and signal contacts in the same connector. For example the same size as a 15 position Standard Density D-Sub you can have what we call a 7W2, which means there is 7 contacts where 2 of them are coaxial contacts, which means there are 5 signal contacts, so 5 signals and 2 coaxial. See the Layout in the Tech Specs on the bottom, there are a lot of combinations of the Mixed Layout alternative.


Antenk's Coaxial D-Sub connectors are available in 5 standard shell sizes with 23 multiple contact arrangements. These reliable, robust combination d-sub connectors allow a combination of signal and coaxial contacts in cable mount, vertical board mount & right angle board mount termination type variations.


Coaxial D-SUB Mixed Contact Solder Cup
Features
Coaxial d-sub for a variety of applications in cable mount.
Signal contacts come pre-loaded. Coaxial contacts supplied - Not Pre-Loaded.

Available in 5 standard shell sizes with 23 multiple contact arrangements: 1W1/ 2V2 /2W2 /3V3/ 3W3/ 5W1/ 5W5

/ 7W2/ 8W8/ 9W4/ 11W1/ 13W3/ 13W6 /17W2/ 17W5 /21W1/ 21W4/ 24W7/ 25W3 /27W2/ 36W4/ 43W2/ 47W1

Allows combination of signal and coaxial d-sub contacts.

Materials
Shell: Steel, nickel plated
Insulator: PBT + 30% fiber-glass - Black, U.L. rated 94V-O
Contacts: Brass - Gold flash over nickel

Notes
Panel Cut-Outs
5W1 = Standard 9 Pin Shell
3W3 / 3W3K / 7W2 / 11W1 = Standard 15 Pin Shell
5W5 / 9W4 / 13W3 / 17W2 / 21W1= Standard 25 Pin Shell
8W8 / 21WA4 = Standard 37 Pin Shell
Other Contact Arrangements Available Upon Request.

Coaxial D-Sub Connector, Coaxial D-Sub with Mixed Layout, Coaxial D-Sub with Mixed with Full Layout,Coaxial D-Sub Male, Coaxial D-Sub Female

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