He Yunbo, general manager of Dazu Optoelectronics, gave a special speech on the theme of “welding wire technology†and shared the technical achievements of Dazu Optoelectronics in this respect.
He Yunbo, general manager of Dazu Optoelectronics
“The wire bonding technology is developed with the continuous evolution of packaging technology. The transformation of wire bonding materials is an important aspect of the development of wire bonding technology. The emergence of palladium-plated copper wire has greatly promoted the development of wire bonding technology and reduced the packaging. Cost." He Yunbo said.
At present, the wire bonding technology has been developed to a higher level, but the requirements for the thin and short package and functional integration of the package have not stopped, and the future welding wire technology will develop to a higher level.
As a domestic packaging equipment supplier, He Yunbo said that providing customers with comprehensive system solutions, improving the technical threshold of products and reducing the procurement cost of equipment will be the development trend of the future packaging equipment industry.
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