21ic News Infineon Technologies AG today announced a new security controller for e Passport, the industry's highest memory density and data processing rate. The new SLE78 with Integrity Guard technology provides more than three times the memory space of previous products for secure storage of personal and biometric data, as well as storage visas or immigration stamps, the latter in the future. On-chip storage will also be required in e-passports. In order to conduct immigration safety checks as efficiently as possible with increasing data, the new safety controllers have read speeds up to eight times faster with electronic scanners. Taking into account the needs of travellers and airport operators, the average reading time of passport data can be less than one second through the contactless scanner at the airport electronic check-in counter.
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Infineon showed the world's fastest e-passport at the Safe Connect Technology Show 2013 at the 2013 CARTES Show (ie Smart Card and Identity Technology Industry Show) in Paris from November 19th to 21st. The SAC (Supplemental Access Control) mechanism caters to the needs of the new generation of e-passports. Yesterday, the e-passport exhibitor was awarded the 2013 Sesames for launching the best products in the field of identity and health cards. This is the winner of an international jury of independent experts in the chip card industry from 319 applicants and 34 finalists in ten different fields.
“Compared to other similar products, the SLE 78 with integrated protection technology combines higher storage density and faster data transfer speed, making it the best choice for a new generation of e-passports,†Infineon Technologies is responsible for government ID commerce. Carsten Loschinsky of the field said, "The Infineon Safety Controller is the first-class solution for electronic documents on the market that require long-term validity, such as passports and ID cards. We are now continuing to expand our reach in the global market."
Lingjie MaskTM Technology - the perfect companion for a new generation of e-passports
In order to meet the requirements of the ICAO (International Civil Aviation Organization) LDS 2.0 standard, electronic passports issued require the ability to store more data than is currently available. Therefore, the security control requirements in terms of storage capacity and processing speed are dramatically increasing.
With its Lingjie mask technology, Infineon has once again set a new safety benchmark for high storage density in a very small space. The new security chip has the industry's highest storage density of 700 kbytes. In addition to having a spatial storage density of around 200 kbytes required for programming, the new SLE 78 also has up to 500 kbytes of flash-based storage for a variety of data. SLE78 not only stores cardholders' personal data and biometric data, but also securely stores a large number of e-visa, hundreds of electronic immigration stamps, and even stores travel loyalty program loyalty points. In contrast, other solutions based on ROM technology can only provide 144 kbytes of storage capacity. Since a large portion of 144 kbytes is used to store passport data such as nationality and issue date, ROM technology quickly reaches its limit when a new generation of e-passports requires higher requirements.
In order to process large amounts of data on border security control as quickly as possible, the new SLE 78 safety controller uses the VHBR (very high bit rate) protocol in accordance with ISO/IEC 14443 with a data rate of 6.8 Mbit/s. In addition, the VHBR protocol improves the stability of contactless communication between electronic passports and related scanners.
Thanks to Infineon's digital security technology "integrated protection", the chip can perfectly meet the increasing security requirements of electronic identity documents. With "integrated protection", data is stored not only in fully encrypted form, but also in encrypted form, which is achieved by two CPUs that monitor each other.
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The 16-bit safety controller is available in two versions: one with a non-contact interface and the other with a dual interface chip that integrates contact and contactless interfaces to help the current technology transition smoothly into the future. The world of contactless products.
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