As the first part of a series on extracting content from Flash chips, this article will guide you through the process of desoldering a Flash chip and designing a custom breakout board. The goal is to demonstrate simple yet effective methods for attacking non-volatile memory in embedded devices. These techniques include:
1. Reading the contents of the memory chip.
2. Modifying the chip's content.
3. Monitoring and altering memory read operations remotely (man-in-the-middle attack).
Imagine opening up an embedded device only to find that its Flash chip is locked down. Curiosity drives you to uncover what's inside. That’s exactly what we’ll do here. Let’s dive into the process.
**Desoldering the Flash Chip**
To access the data stored on a Flash chip, there are typically two approaches: connecting wires directly to the chip's pins or removing the chip and placing it on a separate board. However, the Flash chip we’re working with uses a BGA (Ball Grid Array) package, which has no exposed pins. This means the only viable option is to desolder the chip.
Using a hot air gun, we can carefully heat the area around the chip and lift it off the PCB. While this method is fast and efficient, it requires caution to avoid damaging nearby components or the chip itself.
After desoldering, the PCB reveals a clean layout with empty spaces where the chip once was. This opens up the possibility of creating a custom breakout board to interface with the chip.
**Designing a Custom Breakout Board Using KiCAD**
Now that the chip is removed, the next step is to design a breakout board that allows us to connect to its pins. The first step is to gather information about the chip, such as its model and pin configuration. In our case, the chip is a Macronix MX25L3255EXCI, which has a 4x6 BGA footprint and 8 active pins.
Using KiCAD, we create a schematic and layout for the breakout board. We design a grid that matches the BGA footprint, allowing us to route the signals to external headers. This makes it easier to interface with the chip using a programmer or other tools.
**PCB Manufacturing Process**
Once the design is complete, we need to produce the actual PCB. There are two common methods: etching and CNC milling.
In the **etching method**, we transfer the circuit design onto a copper-clad board using a laser printer and heat press. After etching away the excess copper, we are left with the desired pattern. Finally, we solder the chip onto the board using micro-soldering techniques and solder balls.
In the **CNC milling method**, we use a machine to cut out the traces directly from the copper layer. This method is more precise and avoids the need for chemical etching. We generate a Gerber file from KiCAD, convert it into a format compatible with the CNC machine, and then mill the board accordingly.
After milling, we apply a solder mask and expose it to UV light to protect the copper. We then remove the mask from the BGA area and solder each pin carefully. Once completed, the board is ready to be inserted into an EEPROM programmer for further testing and data extraction.
This process not only provides a hands-on understanding of hardware hacking but also highlights the importance of careful planning and execution when working with delicate components. Whether you're a hobbyist or a professional, these techniques open up new possibilities for exploring and modifying embedded systems.
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