From the smallest Internet of Things (IoT) home automation Sensors to the largest industrial machines, every circuit requires power. Power design requires a lot of work, and the power circuit will take up board space. However, in many applications, end users do not realize the benefits of a better power supply. The design work can be said to be totally unappreciated. The power module is a tested, complete power supply that combines the advantages of low noise, high efficiency, and compact layout, so in these cases power modules can be used to save design effort. The power module is a stand-alone component in a package on a printed circuit board (PCB) that contains the entire switching power supply (including the inductor). Pulse width modulation (PWM) controllers, MOSFET drivers, power MOSFETs, feedback networks, and magnetics are all included in the same package. Advances in power module packaging technology have provided exciting advantages. By integrating passive components into switching regulators, system-level packaging solutions are effectively created for power conversion issues, simplifying and accelerating the design of new products. In this way, designers can focus on other aspects of the design, reducing time-to-market and improving other features of their products.
Figure 1: Advances in Power Module Packaging Technology Simplify and Accelerate New Product Design
The main design challenges in power supplies are stability, transient response, efficiency, EMI, and layout. With discrete on-board power solutions, these characteristics need to be tested for each power supply, even if the design is re-used for a new layout of the new board. Even in circuits that are carefully modeled or previously prototyped, the actual layout can introduce stability issues, electromagnetic emissions, unexpected transient behavior, or unexpectedly effi- cient results. This may add unnecessary design iterations to the project and may delay the release of the entire product. One of the main advantages of the power module is to eliminate these risks. Considering performance, the power layout is mainly in the power module. The inductors, controllers, and power transistors are all packaged together using fixed, tested, and verified internal connections. Efficiency, transient performance, stability, and EMI are listed in the data sheet. Line and load transient response; enabling and disabling transient response; waveforms that even initiate to a short circuit or fault condition can be found in the documentation. This can provide known good performance and complete the design with minimal effort and minimal risk. There is no easier way to achieve onboard DC/DC conversion than power modules.
The second advantage of the power module is the circuit size. The signal wiring inside the module is more compact than on the PCB. Therefore, the module is generally superior to discretely implemented products in terms of power density. In some applications, this produces a difference that matches the shape of the target. End-users want smaller IoT platforms, wearable electronics, and SSD solutions that are small in size. This small size sometimes introduces other issues related to device temperature ratings. Many power modules are only suitable for operation at full load current ratings under temporary or transient load conditions and require derating to lower currents during steady state operation. This is partly due to the natural result of system thermodynamics. Therefore, this requires a better thermal design to handle the same amount of heat in a smaller space. For example, Microchip uses an extremely thermally efficient copper leadframe packaging technology that minimizes thermal resistance compared to PCB-based or multi-step packaging methods. In this way, the Microchip module can operate in steady state at full load rated current in most hot environments and high ambient temperatures.
Max Output Current vs. Temperature Maximum Output Current - Temperature Curve
MAX OUTPUT CURRENT (A) Maximum Output Current (A)
AMBIENT TEMPERATURE (°C) Ambient Temperature (°C)
Figure 2: Thermal derating curves for the MIC45404 when used without airflow and full load. The device can be used with a full output current of 5A at ambient temperatures above 90°C.
Figure 3: Image of the MIC45404 at full load with ambient air at 27°C without airflow. Please note that due to the excellent heat dissipation of the module package, the device temperature rise is only about 30°C higher than the ambient temperature.
Finally, the power module radiation is extremely low. The tightly packed nature minimizes the distance between the components on the phase node and makes the power transistor gate very close to the power driver. In the PCB layout of discrete power supplies, the best practice is to shorten the length of these traces as much as possible so that there is hope that no EMI problems will occur. However, this will not be known until the finished product power supply is tested. For power modules, these connections are internal to the module and their trace lengths are significantly shorter than if each silicon chip were individually packaged and connected together on the PCB. In addition, this module can perform EMI testing alone, regardless of the target circuit in which the module is designed. The Microchip module typically meets the CISPR-22 Class B rating given in the data sheet, so there is no uncertainty in the performance of the final circuit. This not only eliminates the risk of accidental EMI problems; but in general, the total EMI is much lower than if this integrated power solution were not used.
Job# <>Customer: CISPR22, Class B Job Number <>Customer:CISPR22, Class B
DETECTOR: PEAK Detector: Peak
Amplitude [dBuV/m] Amplitude [dBuV/m]
Frequency Frequency
Figure 4: Noise spectrum measured on the MIC28304 power module for 12V input, 5V output, and 3A power conversion tests, showing the comparison of emissions with CISPR-22 Class B rating limits (shown in pink)
The module can also achieve a certain degree of flexibility. Even if the power supply is complete and tested, the selected key operating parameters can be adjusted through external components or trace routing. For example, with Microchip's MIC45404 power module, the output voltage, current limit, and switching frequency can be selected through trace routing on the PCB. The internal comparator checks the external pins to determine if these inputs are grounded, floating, or connected to the power input voltage (using PCB traces on the board). Based on these connections, the controller can select output voltage (nine options), switching frequency (three options), and output current limit (three options) without external passive components (or its tolerance). In this way, one module can meet multiple power requirements in one or more designs without the need to limit and store multiple device numbers.
There are several ways to cause a power failure, but using a power module is not one of them. Modules eliminate the need for inductors and minimize PCB layout. Input, output, and compensation networks can be calculated from the direct formulas in the data sheet to meet application requirements based on stability and transient response requirements. In this way, the system architect is free to spend more time on other parts of the system design, adding value to the final product or shortening the overall time to market. Small, fast, efficient, and easy-to-use power modules represent a new level of integration of power components—a technology that ensures that power is removed from the system design process.
Fionn Sheerin, Senior Product Marketing Engineer, Senior Product Marketing Engineer, Analog and Interface Products, Microchip Technology Inc
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