Qingdao made thin film solar cell international exhibition signed 100 million US dollars orders

Recently, the 5th International Solar PV Exhibition, known as the highest specification of the solar energy industry, was held in Shanghai. Photovoltaic companies from more than 60 countries and regions including Germany, the United States, Japan, and France gathered together. Qingdao Changsheng Ridian Solar Energy Technology Co., Ltd., a new generation of thin-film solar cell and photovoltaic power generation system solution provider from Qingdao, unveiled a new generation of successfully developed next-generation double-junction amorphous silicon thin-film solar cells, attracting the attention of many domestic and foreign customers. , Received intentional orders from more than a dozen countries such as Germany, Mexico, and Australia, nearly 70 megawatts, with an intention to purchase 100 million US dollars.

At this exhibition, Prosperity Nippon Electric Co., Ltd. launched the first-ever high-efficiency double-junction amorphous silicon thin-film solar module AM170C with completely independent intellectual property rights. The initial power per chip reaches 181 watts, the efficiency is as high as 12.5%, and the conversion efficiency of the industry is only 8 Compared to conventional double-junction thin-film PV modules, it can produce nearly 40%-50% more power in the same area, which will enable solar energy system users to obtain the best economic benefits, and set a new standard for the solar photovoltaic industry. milestone.

It is understood that in 2010, Prosperous Nippon Electric Co., Ltd. launched the first large-scale high conversion rate new generation amorphous silicon and copper indium gallium selenide (CIGS) thin-film solar cell production line and large-scale production base in China with a total investment of 1.5 billion yuan. The total planned production capacity reaches 500 megawatts, covering solar energy raw materials, solar panels, photovoltaic modules and thin-film solar photovoltaic power generation system projects. The products are widely used in large-scale industrial and public buildings, new rooftop solar power generation systems, and the use of barren mountains. There are many fields such as the large-scale ground solar power station in the beach and the integration of solar energy building applications.

SMT Stencils

The sole purpose of an SMT stencil is to transfer solder paste to a bare Circuit Board. A stainless steel foil is laser cut creating an opening for every surface mount device on the board. Once the stencil is properly aligned on top of the board, solder paste is applied over the openings (making a single pass, using a metal squeegee blade). When the stainless steel foil is separated from the board, solder paste will remain, ready for placement of the SMD. This process, as opposed to hand soldering methods, ensures consistency and saves time.

Stainless steel foil thickness and aperture opening size control the volume of paste deposited on the board. Too much solder paste causes solder balling, bridging, and tomb-stoning. A lack of solder paste creates insufficient solder joints. All of which compromise the electrical functionality of the board.

Proper foil thickness is chosen based on the types of devices being loaded on the board. Component packages such as 0603 capacitors or 0.020" pitch SOICs, will require a thinner solder paste stencil than larger packages such as 1206 capacitors or 0.050" pitch SOICs. Solder paste stencil thickness ranges from 0.001" to 0.030". The typical foil thickness used on the majority of boards is anywhere from 0.004" to 0.007".
Now offering nano coating on select stencils and sizes! "Nano coating" is a two part, wipe on process, made up of hydrophobic elements that repel flux and solder, resulting in improved paste release for extremely small components. The coating is applied to the contact side of the stencil prior to shipment, making the stencil ready to use right out of the box. This coating is recommended for fine pitch QFN`s, fine pitch IC`s, micro BGA`s, and 0201 component types.

Framed SMT Stencils 

Framed Stencils or glue-in stencils are laser cut stencil foils permanently mounted in a stencil frame using a mesh border to tightly stretch the stencil foil taut in the frame. These solder paste stencils are designed for high volume screen printing on printed circuit boards. They are recommended for Printed Circuit Board assembly when doing production runs. Our framed stencils provide optimum solder pastevolume control. Framed stencils have smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGAs.

Frameless SMT Stencils

Frameless Stencils are laser cut stencilsdesigned to work with stencil tensioning systems also known as Reusable Stencil Frames like the Universal Frame These solder paste stencils do not need to be permanently glued in a frame. Frameless Stencils are significant less expensive than Framed Stencils and reduce storage space requirements.

Frameless Stencils are designed for screen printing on Printed Circuit Boards. They are recommended for prototype printed circuit board assembly or short runs. Our Frameless Stencils provide optimum solder paste volume control. They have smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA's.

Prototype SMT Stencils

Prototype Stencils (standard to 10"x12") are laser cut stencils custom-made for your own printed circuit boards using your Gerber Paste file. Comes with a squeegee blade and board holders.  These frameless solder paste stencilswere specially designed for manual printing. 

Rayming produce Solder Paste Stencils - Laser Cut Stencils,SMT stencils, and offers the largest selection of SMT stencils.


About Us:

BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB , rigid PCB and Flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volumn.

Why Us?

UL (E492586), ISO9001,  ISO14001, TS16949, RoHS certified.
Turnover USD 
10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 
16 layers.
Special Material:
ROGERS, Arlon, Taconic.etc.
Client:
Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.


Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):

ISO9001,ISO14001UL:E492586

Factory Tour:

PCB Manufacturer

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Exhibition:

We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.

Exhibition

Delivery:

BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.
Delivery

FAQ:

Q1: What does BentePCB need for a customized PCB order?
A: The customers need to provide Gerber or pcb file.If you do not have the file in the correct format, you can send all the details related to the products.
Q2: What is your quotation policy?
A: For the PCB order in large quantity, BentePCB will send you the quotation based on the MOQ of the products concerned, and the price will be reasonable with good quality.
Q3: How long will you send us quotation ?
A: After all files were sent, 2 to 8 hours as per your file.
Q4:What is your minimum order quantity?
A:Our MOQ is 1 PCS.
Q5: How about the service BentePCB offered to the customers?
A: If you have any questions about our products or company, do not hesitate to send us your inquiry toour customer service representatives, Your satisfaction is our pursuits.

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