Due to factors such as the extended design cycle of the SoC, System-in-Package (SiP) technology has begun to challenge the SoC solution as an advanced design solution for some wireless applications.
At a meeting of the Wireless Communications Alliance, three representatives from three chip design companies focused on Wi-Fi, UWB and WiMAX said in a speech that the choice between SoC and SiP is still a headache. . However, as many SiP manufacturing and design tools are constantly improving, when it is necessary to shorten the development cycle, when an advanced IC process technology node is used or when the system integrates multiple radios (such as mobile phones, Wi-Fi and Bluetooth), and when the protocol in silicon does not meet the standard, SiP can be a viable option.
According to Winston Sun, a senior member of the Wi-Fi chipset manufacturer Atheros CommunicaTIons, the design cost and development time of SoC technology will increase greatly as the design becomes more complex. On the other hand, if you use SiP technology, even if it is a complicated design, the cost and development time will not grow so much.
Rajeev Krisnamoorthy, founder and CTO of UWB chip design company Tzero Technologies, pointed out that its company was designing a chipset for a wireless HDMI transmitter for UWB transmission when it designed the first product. Blocks are independent of each other, but have not decided which packaging technology to use for future products.
The consensus reached by the participants was that the “best points†of analog process technology and digital process technology were rarely the same, especially after the digital process technology developed to 65 nanometers or higher and then integrated different devices into one. The stability of the package is much greater than that of soldering these devices to the same motherboard. Moreover, system design companies that want the simplest solution will also like this approach because it makes motherboard design much simpler.
Aditya Agrawal of Wice chip design company Beceem CommunicaTIons said that SiP manufacturing has made great progress. As SiP technology becomes more mature, the next step may be to integrate RF and baseband chips into one package instead of the same motherboard.
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